Bisphe­nol A diac­etate CAS 10192-62-8

Iden­ti­fi­ca­tion Prop­er­ties Safe­ty Data Spec­i­fi­ca­tions & Oth­er Information Links

Iden­ti­fi­ca­tion

CAS Number

10192-62-8

Name

Bisphe­nol A diac­etate

Syn­onyms

10192-62-8 [RN] 2,2-Propandiyldi-4,1-phenylen-diacetat [Ger­man] [ACD/IUPAC Name] 2,2-Propanediyldi-4,1-phenylene diac­etate [ACD/IUPAC Name] 233-472-3 [EINECS] Diacé­tate de 2,2-propanediyldi-4,1-phénylène [French] [ACD/IUPAC Name] Phe­nol, 4,4′-(1-methylethylidene)bis-, diac­etate [ACD/​Index Name] Propane-2,2-diyldi-4,1-phenylene diac­etate [4-[1-(4-acetoxyphenyl)-1-methyl-ethyl]phenyl] acetate [4-[2-(4-acetyloxyphenyl)propan-2-yl]phenyl] acetate 2,2-Bis(4-acetoxyphenyl)propane 2,2′-Bis(p-acetoxyphenyl)propane 4-(1-[4-(Acetyloxy)phenyl]-1-methylethyl)phenyl acetate 4,4′-Isopropylidenediphenol diac­etate 4,4′-isopropylidenediphenyl diac­etate 4-[1-(4-acetyloxyphenyl)-isopropyl]phenyl acetate 4-{2-[4-(acetyloxy)phenyl]propan-2-yl}phenyl acetate Acetic acid 4-[1-(4-acetoxy-phenyl)-1-methyl-ethyl]-phenyl ester BISPHE­NOL A DIAC­ETATE bisphe­nol a diac­etate, 99+% MFCD00026194 Phenol,4,4′-(1-methylethylidene)bis-, 1,1′-diacetate propane-2,2-diylbis(4,1-phenylene) diac­etate propane-2,2-diyldibenzene-4,1-diyl diac­etate

SMILES

CC(=O)Oc1ccc(cc1)C(C)(C)c2ccc(cc2)OC(=O)C

Std­InChI

InChI=1S/C19H20O4/c1-13(20)22-17-9-5-15(6-10-17)19(3,4)16-7-11-18(12-8-16)23-14(2)21/h5-12H,1-4H3

Std­InChIKey

NSNHONPM­C­QYM­NT-UHF­F­­FAOYSA-N

Mol­e­c­u­lar Formula

(CH3CO2C6H4)2C(CH3)2

Mol­e­c­u­lar Weight

312.36

EINECS

233-472-3

MDL Number

MFCD00026194

Prop­er­ties

Appear­ance

Fine White Pow­der

Melt­ing Point

91-94 °C (lit.)

Safe­ty Data

Sym­bol

GHS07

Sig­nal Word

Warn­ing

Haz­ard Statements

H315-H319-H335

Pre­cau­tion­ary Statements

P261-P305 + P351 + P338

Per­son­al Pro­tec­tive Equipment

dust mask type N95 (US), Eye­shields, Gloves

RIDADR

NONH for all modes of trans­port

WGK Germany

3 

Spec­i­fi­ca­tions and Oth­er Infor­ma­tion of Our Bisphe­nol A diac­etate CAS 10192-62-8

Stan­dard

Enter­prise stan­dard

Fea­tures

Low cost;Low melt­ing point;Thermal stability;Hydrophobic;Does not impede free rad­i­cal cure

Pack­age

Accord­ing to cus­tomer require­ments to pack­ag­ing

Appli­ca­tion

Used as the Film adhe­sives and Pre-applied adhe­sives.

Links

This prod­uct is devel­oped by our R&D com­pa­ny Warshel Chem­i­cal Ltd(http://​www​.warshel​.com/), and here is the cor­re­spond­ing linkhttp://​www​.warshel​.com/​b​i​s​p​h​e​n​o​l​-​a​-​d​i​a​c​e​t​a​t​e​-​c​a​s​-​1​0​1​9​2​-​6​2​-8/

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