Ben­zo­cy­clobutene CAS 694-87-1

• Iden­ti­fi­ca­tion
• Prop­er­ties
• Safe­ty Data
• Spec­i­fi­ca­tions & Oth­er Information
• Links
• Quick Inquiry

Iden­ti­fi­ca­tion

CAS Number

694-87-1

Name

Ben­zo­cy­clobutene；BCB

Syn­onyms

694-87-1

[RN]
ben­zo­cy­clobu­tane

Ben­zo­cy­clobutene

[Wiki] link-icon
bicyclo(4.2.0)octa-1,3,5-triene

Bicyclo[4.2.0]octa-1,3,5-trien

[Ger­man]

[IUPAC name – gen­er­at­ed by ACD/​Name]
Bicyclo[4.2.0]octa-1,3,5-triene

[IUPAC name – gen­er­at­ed by ACD/​Name]
[IUPAC index name – gen­er­at­ed by ACD/​Name]
Bicyclo[4.2.0]octa-1,3,5-triène

[French]

[IUPAC name – gen­er­at­ed by ACD/​Name]
MFCD01321219

[MDL number]

SMILES

c1ccc2c(c1)CC2

Std­InChI

InChI=1S/C8H8/c1-2-4-8-6-5-7(8)3-1/h1-4H,5-6H2

Std­InChIKey

UMIVXZP­TRXBADB-UHF­F­­FAOYSA-N

Mol­e­c­u­lar Formula

C8H8

Mol­e­c­u­lar Weight

104.152

MDL Number

MFCD01321219

Prop­er­ties

Safe­ty Data

Sym­bol

GHS02

Sig­nal Word

Warn­ing

Haz­ard statements

Pre­cau­tion­ary Statements

WGK Germany

3

MSDS Download

Spec­i­fi­ca­tions and Oth­er Infor­ma­tion of Our Ben­zo­cy­clobutene CAS 694-87-1

Iden­ti­fi­ca­tion Methods

GC

Puri­ty

98% min

Styrene

<1%

O-methyl­ben­zylchlo­ride

<0.6%

O-xylene

<0.8%

Water

<0.2%

Known Appli­ca­tion

1. Micro­elec­tron­ics Insu­lat­ing Mate­r­i­al
Low-k dielec­tric lay­er for inter­met­al dielec­tric (IMD) insu­la­tion in inte­grat­ed cir­cuits, reduc­ing sig­nal delay and pow­er con­sump­tion.
Dielec­tric lay­er in RF (radio fre­quen­cy) and high-fre­quen­­cy devices to min­i­mize sig­nal loss.

2. Opto­elec­tron­ics & Opti­cal Wave­guides
High trans­paren­cy and ther­mal sta­bil­i­ty make BCB suit­able for opti­cal wave­guide core or cladding lay­ers in pho­ton­ic devices and opti­cal com­mu­ni­ca­tion sys­tems.

3. Pas­si­va­tion & Pack­ag­ing
Chip passivation/​protective lay­er to shield against mois­ture, ions, and mechan­i­cal stress.
Buffer and bond­ing mate­r­i­al in flip-chip and MEMS devices.

4. High-Fre­quen­­cy & Anten­na Sub­strates

Low dielec­tric loss and con­stant make it ide­al for high-fre­quen­­cy anten­nas, mil­lime­ter-wave, and 5G RF pack­ag­ing.

5.High-Temperature Coat­ings & Adhe­sives
Blend­ed with oth­er poly­mers or inor­gan­ic mate­ri­als to form ther­mal­ly resis­tant coat­ings or struc­tur­al adhe­sives for electronics.

Relat­ed products

Links

This prod­uct is devel­oped by our R&D com­pa­ny Warshel Chem­i­cal Ltd (https://​www​.warshel​.com/).

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