CAS Number (Or Watson Number for Non-CAS Products)
12325-59-6
Appearance
Powder
Density
9.78g/cm³
Melting Point
2200℃
Boiling Point
Other Information
Purity
4N (99.99%)
Quality Analysis
ICP-MS(99.99% all impurities is below 100ppm), XRD(the main peak is perfectly symmetric )
Package
It is vacuum packed in bottle protected by inert gas.
Applications
The chip diffusion source is used in the semiconductor manufacturing process to introduce specific impurities (dopants) onto the surface of the chip to alter the electrical properties of the material. The diffusion source can be in the form of solid, liquid, or gas and is commonly used in processes such as doping diffusion and ion implantation.