CAS Number (Or Watson Number for Non-CAS Products)
12023-53-9
Appearance
1-20mm particles
Density
6.74g/cm³
Melting Point
1100℃
Boiling Point
Other Information
Purity
3N (99.9%)
Quality Analysis
Package
Applications
The chip diffusion source is used in the semiconductor manufacturing process to introduce specific impurities (dopants) onto the surface of the chip to alter the electrical properties of the material. The diffusion source can be in the form of solid, liquid, or gas and is commonly used in processes such as doping diffusion and ion implantation.