Dipentaerythritol hexaacrylate CAS 29570-58-9

Identification
Properties
Safety Data
Specifications & Other Information
Links
Quick Inquiry

Identification

CAS Number

29570-58-9

Name

Dipentaerythritol hexaacrylate

Synonyms

2-((3-((1-Oxoallyl)oxy)-2,2-bis(((1-oxoallyl)oxy)methyl)propoxy)methyl)-2-(((1-oxoallyl)oxy)methyl)-1,3-propanediyl diacrylate

2-propenoic acid, 3-[(1-oxo-2-propen-1-yl)oxy]-2-[[3-[(1-oxo-2-propen-1-yl)oxy]-2,2-bis[[(1-oxo-2-propen-1-yl)oxy]methyl]propoxy]methyl]-2-[[(1-oxo-2-propen-1-yl)oxy]methyl]propyl ester

249-698-0

[EINECS]
29570-58-9

[RN]
3-(Acryloyloxy)-2-({3-(acryloyloxy)-2,2-bis[(acryloyloxy)methyl]propoxy}methyl)-2-[(acryloyloxy)methyl]propyl acrylate

[ACD/IUPAC Name]
3-(acryloyloxy)-2-({3-(acryloyloxy)-2,2-bis[(acryloyloxy)methyl]propoxy}methyl)-2-[(acryloyloxy)methyl]propyl prop-2-enoate

3-(Acryloyloxy)-2-({3-(acryloyloxy)-2,2-bis[(acryloyloxy)methyl]propoxy}methyl)-2-[(acryloyloxy)methyl]propyl-acrylat

[German]

[ACD/IUPAC Name]
Acrylate de 3-(acryloyloxy)-2-({3-(acryloyloxy)-2,2-bis[(acryloyloxy)méthyl]propoxy}méthyl)-2-[(acryloyloxy)méthyl]propyle

[French]

[ACD/IUPAC Name]
Dipentaerythritol hexaacrylate

SMILES

C=CC(=O)OCC(COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C

StdInChI

InChI=1S/C28H34O13/c1-7-21(29)36-15-27(16-37-22(30)8-2,17-38-23(31)9-3)13-35-14-28(18-39-24(32)10-4,19-40-25(33)11-5)20-41-26(34)12-6/h7-12H,1-6,13-20H2

StdInChIKey

MPIAGWXWVAHQBB-UHFFFAOYSA-N

Molecular Formula

C28H34O13

Molecular Weight

578.567

Properties

Appearance

Safety Data

Symbol

Precautionary Statements

WGK Germany

MSDS Download

Specifications and Other Information of Our Dipentaerythritol hexaacrylate CAS 29570-58-9

Identification Methods

Known Application

Dipentaerythritol hexaacrylate (CAS 29570-58-9) is a multifunctional acrylate crosslinking monomer widely used in UV-curable coatings, inks, photoresins, and 3D printing materials. It significantly enhances hardness, scratch resistance, and mechanical strength of coatings and products, and is also applied in electronic encapsulation and optical materials to improve chemical resistance and heat durability.