Iden­ti­fi­ca­tion

CAS Number

28768-32-3

Name

4,4′-METHYLENEBIS(N,N-DIGLYCIDYLANILINE)

Syn­onyms

2-oxi­ranemethanamine, N,N’-(methylenedi-4,1-phenylene)bis[N’-(oxiranylmethyl)- 4,4′-Methylenebis(N,N-bis(2,3-epoxypropyl)aniline) 4,4′-Methylenebis[N,N-bis(oxiran-2-ylmethyl)aniline] 4,4¦Ã-Methylenebis(N,N-diglycidylaniline) 4,4′-Methylenebis(N,N-diglycidylaniline) 4,“-METHYLENEBIS(N,N-DIGLYCIDYLANILINE) 4,4′-Methylenebis(diglycidyl ani­line) 4,4′-Methylenebis(N,N-diglycidylaniline) 4,4′-methylenebis[N,N-bis(2,3-epoxypropyl)aniline] N,N,N’,N’-TETRAGLYCIDYL-4,4′-METHYLENEBISBENZENAMINE Oxi­ranemethanamine, N,N’-(methylenedi-4,1-phenylene)bis(N-(oxiranylmethyl)- Tetraglycidyl-4,4′-methylene dian­i­line high temp epoxy resin MY720

Mol­e­c­u­lar Structure

Structure of 4,4'-METHYLENEBIS(N,N-DIGLYCIDYLANILINE)-Epoxy Resin(MY720) CAS 28768-32-3

Struc­ture Analysis

With a plu­ral­i­ty of epoxy groups and ben­zene ring in struc­ture, the cur­ing process can form a rel­a­tive­ly high crosslink­ing and aro­mat­ic den­si­ty, which brings the cur­ing prod­uct good heat resis­tance and ther­mal sta­bil­i­ty, excel­lent high-tem­per­a­­ture long-term strength main­tain per­for­mance, low cure shrink­age, chem­i­cal resis­tance, resis­tance to radi­a­tion and heat dis­tor­tion tem­per­a­ture. Dif­fer­ent from con­ven­tion­al high-tem­per­a­­ture with high soft­en­ing point resin type such as phe­nol epoxy resin, poly­imide resin, poly­sul­fone, 4,4′-METHYLENEBIS(N,N-DIGLYCIDYLANILINE)-Epoxy Resin(MY720) CAS 28768-32-3 has low vis­cos­i­ty, whose cured prod­uct has high mechan­i­cal strength and elec­tri­cal insu­la­tion prop­er­ties. These fea­tures above enable it of con­ven­tion­al pro­cess­ing tech­nol­o­gy and sol­vent-free oper­a­tion, which can be used in high class heat-resis­­tant car­bon fiber, aramid fiber and glass fiber com­pos­ite mate­ri­als, whose reac­tion activ­i­ty is high­er than con­ven­tion­al epoxy resins, short­en­ing cur­ing time and improv­ing pro­duc­tion effi­cien­cy.

SMILES

O1CC1CN(c2ccc(cc2)Cc5ccc(N(CC3OC3)CC4OC4)cc5)CC6OC6

Std­InChI

InChI=1S/C25H30N2O4/c1-5-20(26(10-22-14-28-22)11-23-15-29-23)6-2-18(1)9-19-3-7-21(8-4-19)27(12-24-16-30-24)13-25-17-31-25/h1-8,22-25H,9-17H2

Std­InChIKey

FAUAZXVR­LVIARB-UHF­F­­FAOYSA-N

Mol­e­c­u­lar Formula

C25H30N2O4

Mol­e­c­u­lar Weight

422.52

EINECS Number

249-204-3

MDL Number

MFCD00661161

Prop­er­ties

Appear­ance

Dark brown thick­ness liq­uid

Refrac­tive index

n20/​D 1.601(lit.)

Flash Point

113ºC

Den­si­ty

1.15 g/​mL at 25 °C(lit.)

Safe­ty Data

Sym­bol

exclamation-mark-jpgGHS07

Sig­nal Word

Warn­ing

Haz­ard Statements

H317

Pre­cau­tion­ary Statements

P280

Per­son­al Pro­tec­tive Equipment

Eye­shields, Faceshields, full-face res­pi­ra­tor (US), Gloves, mul­ti-pur­­pose com­bi­na­tion res­pi­ra­tor car­tridge (US), type ABEK (EN14387) res­pi­ra­tor fil­ter

Haz­ard Codes (Europe)

Xi

Risk State­ments (Europe)

43

Safe­ty State­ments (Europe)

36/37

WGK Germany

Spec­i­fi­ca­tions and Oth­er Infor­ma­tion of Our 4,4′-METHYLENEBIS(N,N-DIGLYCIDYLANILINE)-Epoxy Resin(MY720) CAS 28768-32-3

Epox­ide Equivalent(g/eq)

111~125

Chroma(G)

10 max

vis­cos­i­ty Index(mPa•s@50℃)

3000~6000

Volatile Mat­ter(%)

0.6 max

Hydrolyzed Chlo­rine(%)

0.1% max

Inor­gan­ic Chlorine(%)

0.002 max

Spec­i­fi­ca­tion and Application

High tem­per­a­ture resistant,apply for 220-270 ℃

Known Appli­ca­tion

1. Car­bon fiber, aramid fiber and glass fiber com­pos­ite mate­r­i­al ; 2. Heat-resis­­tant high-per­­for­­mance aero­space struc­tur­al adhe­sive ; 3. Plas­tic encap­su­la­tion mate­r­i­al, elec­tron­ic encap­su­la­tion mate­ri­als, PCB lam­i­nates ; 4. Anti-radi­a­­tion devices.

Pack­age

5kg/​iron drum, 20kg/​iron, 200kg/​iron drum or per request

Pro­duc­tiv­i­ty

10MT/​month

Stor­age

Room tem­per­a­ture away from light.

Shelf Life

1 year but can be used after retest pass­es for over one year.

Per­for­mance Indi­ca­tor Ref­er­ence Of Resin Cast­ing Body

A vari­ety of cur­ing agents are applic­a­ble for 4,4′-METHYLENEBIS(N,N-DIGLYCIDYLANILINE)-Epoxy Resin(MY720) CAS 28768-32-3, typ­i­cal­ly methyl tetrahy­droph­thal­ic anhy­dride, methyl hexa­hy­droph­thal­ic anhy­dride, hexa­hy­droph­thal­ic anhy­dride, methyl­nadic anhy­dride and aro­mat­ic amine cur­ing agents such as diamin­odiphenyl sul­fone (DDS) and diamino diphenyl methane (DDM). Usage amount and tem­per­a­ture con­trol should be strict­ly paid atten­tion to. Exother­mic reac­tion should be espe­cial­ly con­cerned when using the accel­er­a­tor to pre­vent implosion. 
MTH­PA(Methyl Tetrahy­droph­thal­ic Anhydride)MNA(methyl­nadic anhydride)DDS(Diamino diphenyl sulfone)Aro­mat­ic amine(WN-521)
Amount of cur­ing agent(Phr)1301404035
Accel­er­a­tor name/amount(Phr)WN-210 1WN-210 1
Cur­ing condition80℃/2h+100℃/1h+160℃/6h80℃/3h+160℃/2h+180℃/6h80℃2h+110℃1h+150℃4h+200℃7h150℃2h+180℃2h
Bend­ing strength(Mpa)869089120
Flex­ur­al modulus(Mpa)3200330034003000
Pulled strength(Mpa)36186072
Pulled modulus(Mpa)3100315037003200
Elon­ga­tion at break(%)2.31.61.82.8
Impact strength(Kj/m2)10.412.51618
Tg tem­prea­ture(DSC Method)210-220220-230250-260230-240
Heat Deflec­tion Temperature(℃)205-215215-225245-255225-235
Vol­ume resistivity(Ω.cm)5*10155*10151*10161.1*1016
Sur­face resistivity(Ω)1*10161*10164.2*10167.1*1016
Break­down volt­age(KV/​mm)26262828

Wat­­son-Int Link

http://​wat​son​-int​.com/​E​p​o​x​y​-​R​e​s​i​n​-​M​Y​7​2​0​-​C​A​S​_​2​8​7​6​8​-​3​2​-​3​.​h​tml