Why Print­ed Con­duc­tive Mate­ri­als Mat­ter Now

Smart­phone anten­nas, auto­mo­tive defrost­ing cir­cuits on panoram­ic glass roofs, wear­able ECG elec­trodes, and EMI shield­ing lay­ers inside tele­com base sta­tions all rely on the same under­ly­ing cat­e­go­ry of mate­r­i­al : con­duc­tive paste that can be print­ed, sprayed, or mold­ed onto a sur­face much like ink. As con­sumer elec­tron­ics get thin­ner and more curved, as vehi­cles add more sen­sors and glass sur­faces, and as 5G and IoT devices pro­lif­er­ate, tra­di­tion­al cop­per-etch­ing and met­al-stam­p­ing approach­es increas­ing­ly fall short — they are cost­ly, inflex­i­ble, and incom­pat­i­ble with curved hous­ings, stretch­able sub­strates, or ultra-fine cir­cuit geome­tries. This is pre­cise­ly the gap that ChemWhat’s two core prod­uct lines are built to close : con­duc­tive pastes for cir­cuit and shield­ing.

Con­duc­tive Pastes for Cir­cuit : 18 Prod­uct Cat­e­gories Across the Print­ed Elec­tron­ics Landscape

ChemWhat’s con­duc­tive cir­cuit paste line spans rough­ly 18 sub-cat­e­­gories, for­mu­lat­ed to match spe­cif­ic sub­strates (PET, ITO, PC, PC/GF, PA, PPS, TPU, glass, ceram­ic, sil­i­con, PEEK, PI, and nano-sil­ver films), cur­ing pro­files (low-tem­per­a­­ture cure at 80 – 90°C, fast cure around 135°C, or sin­ter­ing-type sys­tems), and appli­ca­tion process­es (screen print­ing, pad print­ing, trans­fer print­ing, spray­ing, and laser etching).

  • Anten­na feed-point and ultra­son­ic mod­ule pastes : designed for direct print­ing on curved phone hous­ings ; cure at 80 – 90°C ; with­stand 5,000+ abra­sion cycles ; retain ≥4B adhe­sion after 1,000+ hours of 85°C/85% RH aging, plus tem­per­a­ture cycling (+80°C/500h, –40°C/500 – 1,200h) and salt-spray expo­sure (5% NaCl, 35°C, 72h).
  • Print­ed FPC and touch-sen­­sor pastes : stan­dard screen print­ing achieves 60 μm line width/​spacing ; com­bined with laser etch­ing, sub-30 μm fine lines are achiev­able — sup­port­ing the increas­ing­ly dense rout­ing needs of lap­tops, tablets, and smart­phone touch panels.
  • Stretch­able con­duc­tive sil­ver paste : engi­neered for wear­ables, auto­mo­tive panoram­ic roofs, and med­ical elec­trode patch­es ; with­stands 2,000+ stretch cycles at 30% elon­ga­tion while main­tain­ing sta­ble resis­tance and adhe­sion, so ECG elec­trodes and roof-glass defrost­ing cir­cuits sur­vive repeat­ed flex­ing with­out open­ing the circuit.
  • Auto­mo­tive body-print­­ed and heat­ing-cir­cuit pastes : extend the same flex­i­ble-print­­ing plat­form to inte­ri­or demist­ing, defrost­ing, and seat-heat­ing circuits.
  • Lidar mod­ule paste : a ded­i­cat­ed for­mu­la­tion for appli­ca­tions where print pre­ci­sion and sig­nal integri­ty are critical.
  • Sol­der­able low-tem­per­a­­ture paste : bridges print­ed con­duc­tive cir­cuits with con­ven­tion­al sol­der­ing process­es for hybrid assem­bly workflows.
  • Low-tem­per­a­­ture sin­tered anten­na paste : forms a dense, low-resis­­tance con­duc­tive lay­er at reduced sin­ter­ing tem­per­a­tures, suit­ed to mobile phone and tele­com anten­na appli­ca­tions requir­ing tight resis­tance consistency.
  • Nanoim­print sil­ver paste, PEDOT :PSS trans­par­ent con­duc­tive ink, and trans­par­ent anten­na paste : enable met­al-mesh and tran­s­­par­ent-elec­trode struc­tures that pre­serve high opti­cal trans­paren­cy while pro­vid­ing a con­duc­tive path — used in trans­par­ent anten­nas and touch-sen­­sor electrodes.
  • Capacitor/​resistor ter­mi­na­tion paste and induc­tor paste : sup­port pas­­sive-com­po­­nent man­u­fac­tur­ing, pro­vid­ing con­duc­tive ter­mi­na­tion at com­po­nent elec­trode ends.
  • Smart-sen­s­ing sil­ver paste : used to print elec­trodes for pres­sure and tem­per­a­ture sen­sors in wear­able and IoT devices.

Sheet resis­tance across the line ranges from rough­ly 4 mΩ/□/mil for low-tem­per­a­­ture sin­tered anten­na paste to around 30 mΩ/□/mil for gen­er­al-pur­­pose for­mu­la­tions, allow­ing selec­tion based on tar­get cir­cuit resis­tance. Col­lec­tive­ly, these cat­e­gories cov­er the dom­i­nant print­­ed-con­­duc­­tive-mate­r­i­al use cas­es across con­sumer elec­tron­ics, auto­mo­tive elec­tron­ics, med­ical elec­tron­ics, and IoT devices.

Con­duc­tive Pastes for Shield­ing : Pro­tect­ing Sig­nal Integri­ty at the Seam

Every elec­tron­ic enclo­sure has seams and con­nec­tor inter­faces that need EMI shield­ing — with­out it, phone sig­nals inter­fere with one anoth­er and auto­mo­tive elec­tron­ic sys­tems can mis­be­have. ChemWhat’s shield­ing mate­ri­als fall into three groups :

  • Shield­ing pastes (sil­ver, sil­ver-alu­minum, sil­ver-cop­per, and nick­­el-car­bon): sprayed direct­ly onto the inte­ri­or wall of an enclo­sure to form a shield­ing lay­er, achiev­ing shield­ing effec­tive­ness (per MIL-DTL-83528C / MIL-STD-285) of up to 110 dB across the 0.3 – 20 GHz band, with mate­r­i­al-spe­­cif­ic ranges from rough­ly 65 dB to 120+ dB depend­ing on con­­duc­­tive-lay­er chem­istry and shield­ing grade required.
  • Con­duc­tive shield­ing gas­kets and elas­tomer­ic con­duc­tive con­nec­tors : a high-resilience sil­i­cone core with an out­er con­duc­tive lay­er (sil­ver, alu­minum-sil­ver, glass-sil­ver, nick­­el-sil­ver, or nick­­el-car­bon, selec­table by appli­ca­tion) that seals while shield­ing. These oper­ate across –55°C to 160°C (per ASTM D1329), show com­pres­sion set below 10 – 12% (per ASTM D395), and sur­vive 25,000 com­pres­sion cycles with­out crack­ing or delam­i­na­tion ; sur­face and vol­ume resis­tiv­i­ty remain sta­ble after 1,000 hours of 100°C dry-heat aging and 1,000 hours of 85°C/85% RH humid aging.
  • FIP (Form-in-Place) nick­­el-car­bon gas­ket adhe­sive : extends shield­ing cov­er­age into tighter, more intri­cate geome­tries where a pre-formed gas­ket isn’t practical.

Envi­ron­men­tal and safe­ty com­pli­ance across the shield­ing line includes UL 94 HB flame-retar­­dant rat­ing, RoHS con­for­mance (per IEC 62321), halo­­gen-free per­for­mance (per BS EN 14582), and Grade 0 mold-resis­­tance per GB/T 2423.16 — sup­port­ing deploy­ment in 5G base sta­tions, aero­space equip­ment, rail tran­sit sys­tems, and elec­tric vehi­cles, all of which demand long-term envi­ron­men­tal reliability.

Two Pro­pri­etary Tech­nolo­gies Behind the Performance

Deliv­er­ing fine-line print res­o­lu­tion, stretch­a­bil­i­ty, shield­ing effec­tive­ness, and dura­bil­i­ty under repeat­ed mechan­i­cal stress simul­ta­ne­ous­ly depends on two tech­nol­o­gy platforms :

  1. Flex­i­ble print­ing tech­nol­o­gy — high-pre­­ci­­sion print­ing and laser direct-writ­ing that achieve micron-scale (and in some for­mu­la­tions, sub-micron) con­duc­tive pat­tern for­ma­tion, bal­anc­ing res­o­lu­tion with pro­duc­tion throughput.
  2. Elas­tic shield­ing tech­nol­o­gy — pur­­pose-built to pre­serve the elec­tri­cal and mechan­i­cal reli­a­bil­i­ty of flex­i­ble, stretch­able con­duc­tive mate­ri­als after repeat­ed defor­ma­tion, a capa­bil­i­ty val­i­dat­ed through the com­pres­­sion-cycle and ther­­mal-aging test­ing ref­er­enced above.

Why ChemWhat

ChemWhat offers both the breadth of for­mu­la­tion options and the depth of val­i­dat­ed reli­a­bil­i­ty data that sourc­ing and engi­neer­ing teams need to eval­u­ate a mate­ri­als part­ner. The com­pa­ny fur­ther sup­ports fast deliv­ery, respon­sive tech­ni­cal ser­vice, and cus­tom for­mu­la­tion devel­op­ment based on a customer’s spe­cif­ic sub­strate, process win­dow, and reli­a­bil­i­ty require­ments. For orga­ni­za­tions cur­rent­ly sourc­ing con­duc­tive cir­cuit or shield­ing mate­ri­als for con­sumer elec­tron­ics, wear­ables, auto­mo­tive elec­tron­ics, 5G infra­struc­ture, or aero­space appli­ca­tions, ChemWhat’s tech­ni­cal team is avail­able to dis­cuss require­ments direct­ly and arrange sam­ple evaluation.

Prod­uct Index

ChemWhat Con­duc­tive Cir­cuit & Shield­ing Paste Prod­uct Index (click a row to jump to full specifications)
Appli­ca­tion Direc­tionProd­uct CodeOverview
Ultra­son­ic Mod­ule PasteWI-TL50S-A / WI-600AA RoHS-com­­pli­ant, gen­er­al-pur­­pose low-tem­per­a­­ture-cur­ing con­duc­tive sil­ver paste designed for mul­ti-lay­er print­ing on PET, ITO, and…
PDS Anten­na PasteWI-TL600A / WI-TL600AB / WI-TL600B / WI-TL600B7A fam­i­ly of RoHS-com­­pli­ant PDS (print­ed direct struc­tur­ing) cir­cuit / anten­na feed-point sil­ver pastes, includ­ing a solvent-free…
Print­ed FPC Paste (Laptop/​Notebook)WI-TL50B / WI-TL50D10 / WI-TL50D11E / WI-TL50SA series of RoHS-com­­pli­ant, gen­er­al-pur­­pose low-tem­per­a­­ture-cur­ing con­duc­tive sil­ver pastes for­mu­lat­ed for fine-line print­ing on…
Stretch­able Con­duc­tive PasteWI-ST80S / WI-ST80V / WI-ST80B / WI-ST70A / WI-ST70B3 (WI-ST80 series)A RoHS-com­­pli­ant stretch­able con­duc­tive sil­ver paste series using high­ly flex­i­ble resin as the binder phase and fine/​flake sil­ver powder…
Lidar Mod­ule PasteWI-TL20E4CA RoHS-com­­pli­ant con­duc­tive sil­ver paste specif­i­cal­ly for­mu­lat­ed for lidar mod­ule appli­ca­tions, offer­ing good print­abil­i­ty suit­ed to the…
Med­ical Elec­trode PasteWI-ST80A2C3A RoHS-com­­pli­ant flex­i­ble-cir­cuit-print­­ing con­duc­tive sil­ver paste suit­ed to wear­able devices and med­ical elec­trode patch­es, using an…
Auto­mo­tive Body-Print­­ed PasteWI-ST80V02A RoHS-com­­pli­ant fast-cur­ing con­duc­tive sil­ver paste for flex­i­ble cir­cuit print­ing, suit­ed to print­ing on a vari­ety of flexible…
Auto­mo­tive Panoram­ic-Roof Defrost­ing PasteWI-ST80C / WI-ST80B (WI-ST80 series)Part of the same RoHS-com­­pli­ant flex­i­ble-cir­cuit-print­­ing sil­ver paste plat­form used to print defrosting/​demisting heater circuits…
Touch Sen­sor PasteWI-TL20E3 / WI-TL20EA / WI-TL30A / WI-ST70AA fam­i­ly of RoHS-com­­pli­ant ultra-fine-line, laser-etch­ing-com­­pat­i­ble con­duc­tive sil­ver pastes (and a ded­i­cat­ed resistive-touch-screen…
Heat­ing Cir­cuit PasteWI-ST80C2A RoHS-com­­pli­ant flex­i­ble-cir­cuit-print­­ing con­duc­tive sil­ver paste specif­i­cal­ly suit­ed to print­ing con­duc­tive heat­ing cir­cuits for…
Sol­der­able Low-Tem­per­a­­ture PasteWI-TL60S2A RoHS-com­­pli­ant gen­er­al-pur­­pose con­duc­tive sil­ver paste offer­ing both good fine-line print­abil­i­ty and sol­der­abil­i­ty, enabling…
Sin­tered Anten­na PasteWI-INK135S2 / WI-INK135S29C / WI-INK135S29D / WI-INK135S­G9A RoHS-com­­pli­ant low-tem­per­a­­ture sin­tered anten­na sil­ver paste series suit­ed to a vari­ety of com­mu­ni­ca­tion devices and mobile terminal…
Nanoim­print Sil­ver PasteWI-INK135S29DA nano con­duc­tive sil­ver paste pur­­pose-built for met­al-mesh tech­nol­o­gy appli­ca­tions, offer­ing excel­lent fill­ing capa­bil­i­ty, thixotropy,…
PEDOT Trans­par­ent Con­duc­tive InkPD-101A screen-print­­able trans­par­ent con­duc­tive ink based on the con­duc­tive poly­mer PEDOT :PSS, for­mu­lat­ed with a suit­able thick­en­er to raise…
Trans­par­ent Anten­na PasteWI-INK135S29CA nano con­duc­tive sil­ver paste pur­­pose-built for met­al-mesh tech­nol­o­gy appli­ca­tions used in trans­par­ent anten­na struc­tures, offering…
Capacitor/​Resistor Ter­mi­na­tion PasteWI-ST60S1 / WI-ST60S11EFA fam­i­ly of RoHS- and REACH-com­­pli­ant con­duc­tive sil­ver pastes for capac­i­tor and resis­tor com­po­nent end-ter­mi­­na­­tion pro­tec­tion, using a…
Induc­tor PasteWI-ST60SA RoHS-com­­pli­ant fine-line screen-print­­ing con­duc­tive sil­ver paste on the WI-ST60 plat­form, capa­ble of print­ing line width/​spacing down…
Smart Sens­ing Paste (Smart Wear­able Paste)WI-ST80R1A RoHS-com­­pli­ant con­duc­tive sil­ver paste devel­oped for elec­tro­­mag­net­ic-shield­­ing seal­ing equip­ment and smart wearable/​sensing…
Con­duc­tive Shield­ing Paste (Ag / Ag-Al / Ag-Cu / Ni-C)WI-ST219S / WI-ST201S / WI-ST201SP / WI-ST203 / WI-ST201A / WI-YL18 / WI-ST201ALA fam­i­ly of RoHS-com­­pli­ant EMI shield­ing pastes (sil­ver, sil­ver-alu­minum, and nick­­el-car­bon chemistries) applied via screen printing,…
Con­duc­tive Shield­ing Gas­ket & Elas­tomer­ic Con­duc­tive ConnectorWI-SL2012 / WI-SL2022 / WI-SL2031 / Elas­tomer­ic Con­duc­tive ConnectorA sil­i­­cone-core, sil­ver- or nick­­el-car­bon-coat­ed elas­tomer prod­uct line (dual-col­or com­pos­ite shield­ing gas­kets and hollow-cylinder…
FIP (Form-in-Place) Nick­­el-Car­bon Gas­ket AdhesiveWI-NP05 / WI-NP06A two-com­po­­nent, low-tem­per­a­­ture-cur­ing con­duc­tive adhe­sive com­posed pri­mar­i­ly of sil­i­cone rub­ber and nick­­el-coat­ed graphite powder,…

Full Prod­uct Specifications

Ultra­son­ic Mod­ule PasteWI-TL50S-A / WI-600A

A RoHS-com­­pli­ant, gen­er­al-pur­­pose low-tem­per­a­­ture-cur­ing con­duc­tive sil­ver paste designed for mul­ti-lay­er print­ing on PET, ITO, and glass sub­strates used in ultra­son­ic sen­sor mod­ules. Cures in three sequen­tial print­ed lay­ers, each opti­mized for con­duc­tiv­i­ty, adhe­sion, and hardness.

  • Excel­lent con­duc­tiv­i­ty on PET-Film and ITO-Film
  • dense cured film with high sur­face hard­ness and strong adhesion
  • good chem­i­cal and weath­er­ing resistance
  • sta­ble print­ing per­for­mance with good screen-reten­­tion behavior.
Appear­ance / Col­orSil­ver-gray paste (visu­al inspection)
Vis­cos­i­ty310+/-30 dPa.s (Nis­sho 2# rotor) / 33,000+/-5,000 cps (Brook­field DV2T, spin­dle 52#, 5 rpm)
Sol­id Con­tent81+/-2% (burn-off method, tin-foil sub­strate, 100C/​60min)
Sheet Resis­tance / Vol­ume Resis­tiv­i­ty<=30 mOhm/​sq/​mil, all 3 lay­ers (four-point probe/​multimeter)
Adhe­sion>=4B per lay­er (crosscut/​3M 681 tape)
Hard­ness>=3H per lay­er (pen­cil hardness)
Cure Con­di­tionsLay­er 1/2/3 : 80C/2-4h, 100C/1-2h, 120C/50-90min (hot-air oven); lay­er thick­ness 4-6 / 8-12 / 12-18 um
Print­ing / Process Para­me­tersScreen print­ing : squeegee angle 60-80deg, depth 1-2mm ; print speed 100-300m­m/s ; print thick­ness 4-6um ; screen 420 mesh poly­ester ; wash sol­vent eth­yl acetate/​DBE ; inter-pass inter­val 10-15min
Reli­a­bil­i­ty & Aging Test Results>=4B adhe­sion after 85C/85%RH/​500h ; >=4B after +80C/​500h & -40C/​500h ther­mal cycling ; >=4B after 5% NaCl/​35C/​72h salt spray
Stor­age Con­di­tions & Shelf LifeVac­u­um-packed ; store 0C to -10C, dark, sealed ; shelf life 120 days ; use with­in 72h of open­ing (max 2 reuse cycles if resealed with­in 72h, else con­tin­ue at 0~-10C); trans­port at 0~-10C, max 5 days ; warm to room temp (23+/-2C) for 8h before use ; stir 5-10min at 30-50rpm (or plan­e­tary mix­er 1,000rpm/2min)
Dilu­tion Ratio & Vis­cos­i­ty DropDilu­ent ZK-TL50S-A, max 2% of total mass. Vis­cos­i­ty drop : 0.5% -> 50-100 dPa.s ; 1.0% -> 100-200 ; 1.5% -> 150-250 ; 2.0% -> 200-250
PDS Anten­na PasteWI-TL600A / WI-TL600AB / WI-TL600B / WI-TL600B7

A fam­i­ly of RoHS-com­­pli­ant PDS (print­ed direct struc­tur­ing) cir­cuit / anten­na feed-point sil­ver pastes, includ­ing a sol­vent-free low-tem­per­a­­ture-cur­ing via-hole paste (WI-TL600AB) and high-abra­­sion, low-tem­per­a­­ture-cur­ing anten­na feed-point pastes (WI-TL600B/B7) for anten­nas in com­mu­ni­ca­tion ter­mi­nals and mobile devices.

  • Excel­lent con­duc­tiv­i­ty, abra­sion resis­tance, and adhe­sion after curing
  • suit­ed to mul­ti­ple ter­mi­­nal-device anten­na print­ing processes
  • via-hole vari­ant enables reli­able through-hole con­duc­tion in low-tem­per­a­­ture epoxy systems.
Appear­ance / Col­orN/A
Vis­cos­i­tyN/A
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­tyN/A
Adhe­sion>=4B (crosscut/​3M610 or CT-24 tape) — WI-600A rep­re­sen­ta­tive data
Hard­ness>=4H (pen­cil hard­ness) — WI-600A rep­re­sen­ta­tive data
Cure Con­di­tionsN/A
Print­ing / Process Para­me­tersN/A
Reli­a­bil­i­ty & Aging Test ResultsAdhe­sion >=4B after 85C/85%RH/1,200h high-tem­p/hu­mid­i­­ty aging (four-point probe/​multimeter)
Stor­age Con­di­tions & Shelf LifeWI-TL600AB : vac­u­um-packed, store -40C to -20C ; 6-month shelf life under these conditions
Dilu­tion Ratio & Vis­cos­i­ty DropN/A
Print­ed FPC Paste (Laptop/​Notebook)WI-TL50B / WI-TL50D10 / WI-TL50D11E / WI-TL50S

A series of RoHS-com­­pli­ant, gen­er­al-pur­­pose low-tem­per­a­­ture-cur­ing con­duc­tive sil­ver pastes for­mu­lat­ed for fine-line print­ing on flex­i­ble print­ed cir­cuits (FPC) used in lap­tops and note­book com­put­ers, with good fine-line printability.

  • Good fine-line print res­o­lu­tion and pat­tern definition
  • sta­ble print per­for­mance across mul­ti­ple pro­duc­tion batches
  • com­pat­i­ble with stan­dard screen-print­­ing equip­ment and processes.
Appear­ance / Col­orN/A
Vis­cos­i­tyN/A
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­tyApprox. 20-30 mOhm/​sq/​mil (fam­i­­ly-typ­i­­cal, four-point probe/​multimeter)
Adhe­sion>=4B (fam­i­­ly-typ­i­­cal, cross­cut tape)
Hard­nessN/A
Cure Con­di­tionsLow-tem­per­a­­ture cure pro­file, con­sis­tent with WI-TL series (typ­i­cal­ly 80-130C staged cure)
Print­ing / Process Para­me­tersScreen print­ing down to approx. 60um line width/​spacing
Reli­a­bil­i­ty & Aging Test ResultsN/A
Stor­age Con­di­tions & Shelf LifeStan­dard series guid­ance (typ­i­cal across WI-TL fam­i­ly): vac­u­um-packed, store 0-10C dark ; use with­in ~1 week of open­ing ; ~6-month shelf life ; warm to room temp (23+/-2C) 2h before use ; stir 5-10min at 30-50rpm
Dilu­tion Ratio & Vis­cos­i­ty DropProd­uct-spe­­cif­ic dilu­ent (ZK-series), typ­i­cal­ly max 2% of total mass (fam­i­­ly-typ­i­­cal ; spe­cif­ic drop-curve not cap­tured for this code)
Stretch­able Con­duc­tive PasteWI-ST80S / WI-ST80V / WI-ST80B / WI-ST70A / WI-ST70B3 (WI-ST80 series)

A RoHS-com­­pli­ant stretch­able con­duc­tive sil­ver paste series using high­ly flex­i­ble resin as the binder phase and fine/​flake sil­ver pow­der as the con­duc­tive phase, devel­oped for flex­i­ble cir­cuit print­ing on wear­able devices and oth­er stretch­able sub­strates such as PET, TPU, and graphene films.

  • Excel­lent flex­i­bil­i­ty and fold resistance
  • strong com­pat­i­bil­i­ty with flex­i­ble sub­strates (PET, TPU, graphene)
  • good con­duc­tiv­i­ty, abra­sion resis­tance, and weatherability
  • main­tains sta­ble resis­tance and adhe­sion under repeat­ed stretching.
Appear­ance / Col­orSil­ver-gray paste (visu­al inspec­tion) — family-typical
Vis­cos­i­tyApprox. 14,000+/-3,000 cP (Brook­field CP-51, 15rpm) — family-typical
Sol­id Con­tentApprox. 75+/-2% — family-typical
Sheet Resis­tance / Vol­ume Resis­tiv­i­tyApprox. 18 mOhm/​sq/​mil (four-point probe) — family-typical
Adhe­sion>=4B (crosscut/​3M610 tape) — family-typical
Hard­ness>=2H (pen­cil hard­ness) — family-typical
Cure Con­di­tionsApprox. 60min @ 130C on PET (oven) — family-typical
Print­ing / Process Para­me­tersN/A
Reli­a­bil­i­ty & Aging Test ResultsWith­stands 30% elon­ga­tion for 2,000+ repeat­ed stretch cycles with sta­ble resistance/​adhesion
Stor­age Con­di­tions & Shelf LifeStan­dard series guid­ance : vac­u­um-packed, store 0-10C dark ; use with­in ~1 week of open­ing ; 6-month shelf life ; warm to room temp (23+/-2C) 2h before use ; stir 5-10min at 30-50rpm
Dilu­tion Ratio & Vis­cos­i­ty DropProd­uct-spe­­cif­ic dilu­ent (ZK-series), typ­i­cal­ly max 2% of total mass
Lidar Mod­ule PasteWI-TL20E4C

A RoHS-com­­pli­ant con­duc­tive sil­ver paste specif­i­cal­ly for­mu­lat­ed for lidar mod­ule appli­ca­tions, offer­ing good print­abil­i­ty suit­ed to the pre­ci­sion cir­cuit pat­terns required in lidar sens­ing components.

  • Good print adapt­abil­i­ty for fine, high-pre­­ci­­sion cir­cuit patterns
  • sta­ble con­duc­tiv­i­ty suit­ed to lidar mod­ule sig­­nal-path requirements
  • con­sis­tent with the WI-TL20 ultra-fine-line laser-etch­ing paste family.
Appear­ance / Col­orN/A
Vis­cos­i­tyN/A
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­tyCon­sis­tent with WI-TL20 fam­i­ly (low mOhm/​sq/​mil range ; spe­cif­ic val­ue not cap­tured for this code)
Adhe­sionN/A
Hard­nessN/A
Cure Con­di­tionsLaser-etch­ing com­pat­i­ble cure pro­file, con­sis­tent with WI-TL20 family
Print­ing / Process Para­me­tersLaser pow­er approx. 25-35% (per process-para­me­ter guid­ance in the tech­ni­cal data sheet)
Reli­a­bil­i­ty & Aging Test ResultsN/A
Stor­age Con­di­tions & Shelf LifeStan­dard series guid­ance : vac­u­um-packed, store 0-10C dark ; ~6-month shelf life ; warm to room temp before use
Dilu­tion Ratio & Vis­cos­i­ty DropN/A
Med­ical Elec­trode PasteWI-ST80A2C3

A RoHS-com­­pli­ant flex­i­ble-cir­cuit-print­­ing con­duc­tive sil­ver paste suit­ed to wear­able devices and med­ical elec­trode patch­es, using an ultra-flex­i­ble resin binder com­bined with fine sil­ver pow­der and flake pow­der as the con­duc­tive phase to improve con­duc­tiv­i­ty and fold resistance.

  • Excel­lent flexibility
  • strong com­pat­i­bil­i­ty with flex­i­ble sub­strates such as PET, TPU, and graphene
  • good con­duc­tiv­i­ty, abra­sion resis­tance, and weatherability.
Appear­ance / Col­orSil­ver-gray paste (visu­al inspection)
Vis­cos­i­ty14,000+/-3,000 cP (Brook­field CP-51, 15rpm)
Sol­id Con­tent75+/-2% (cal­cu­lat­ed by charge weight)
Sheet Resis­tance / Vol­ume Resis­tiv­i­ty<=18 mOhm/​sq/​mil (four-point probe)
Adhe­sion>=4B (crosscut/​3M610 tape)
Hard­ness>=2H (pen­cil hardness)
Cure Con­di­tions60min @ 130C on PET (oven)
Print­ing / Process Para­me­tersScreen print­ing : squeegee angle 60-80deg, depth 0.5-2mm ; print speed 100-300m­m/s ; print thick­ness 6-8um ; screen 250-350 mesh, stain­less steel/​polyester recommended
Reli­a­bil­i­ty & Aging Test ResultsN/A
Stor­age Con­di­tions & Shelf LifeVac­u­um-packed ; store 0-10C dark ; shelf life 6 months from pro­duc­tion ; warm to room temp (23+/-2C) 2h before use ; stir 5-10min at 30-50rpm
Dilu­tion Ratio & Vis­cos­i­ty DropDilu­ent ZK-80A2C3, max 2% of total mass (spe­cif­ic vis­­cos­i­­ty-drop curve not cap­tured for this code)
Auto­mo­tive Body-Print­­ed PasteWI-ST80V02

A RoHS-com­­pli­ant fast-cur­ing con­duc­tive sil­ver paste for flex­i­ble cir­cuit print­ing, suit­ed to print­ing on a vari­ety of flex­i­ble thin-film sub­strates used in auto­mo­tive body/​interior applications.

  • Fast cure profile
  • good print­abil­i­ty on flex­i­ble thin films
  • con­sis­tent con­duc­tiv­i­ty and adhe­sion per­for­mance in line with the broad­er WI-ST80 flex­i­ble-print­­ing paste family.
Appear­ance / Col­orN/A
Vis­cos­i­tyN/A
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­tyCon­sis­tent with WI-ST80 fam­i­ly (approx. high-teens mOhm/​sq/​mil ; spe­cif­ic val­ue not cap­tured for this code)
Adhe­sion>=4B (fam­i­­ly-typ­i­­cal)
Hard­ness>=2H (fam­i­­ly-typ­i­­cal)
Cure Con­di­tionsFast-cure pro­file (spe­cif­ic time/​temp not cap­tured for this code)
Print­ing / Process Para­me­tersN/A
Reli­a­bil­i­ty & Aging Test ResultsN/A
Stor­age Con­di­tions & Shelf LifeStan­dard series guid­ance : vac­u­um-packed, store 0-10C dark ; ~6-month shelf life ; warm to room temp before use
Dilu­tion Ratio & Vis­cos­i­ty DropN/A
Auto­mo­tive Panoram­ic-Roof Defrost­ing PasteWI-ST80C / WI-ST80B (WI-ST80 series)

Part of the same RoHS-com­­pli­ant flex­i­ble-cir­cuit-print­­ing sil­ver paste plat­form used to print defrosting/​demisting heater cir­cuits direct­ly onto auto­mo­tive panoram­ic glass roofs, lever­ag­ing the series' flex­i­bil­i­ty and adhe­sion to glass and film substrates.

  • Good flex­i­bil­i­ty and fold resis­tance suit­ed to curved/large-for­­mat glass printing
  • sta­ble heater-cir­cuit resistance
  • good adhe­sion to glass substrates
  • good abra­sion and weath­er­ing resistance.
Appear­ance / Col­orN/A
Vis­cos­i­tyN/A
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­tyCon­sis­tent with WI-ST80 fam­i­ly (approx. high-teens mOhm/​sq/​mil)
Adhe­sion>=4B (fam­i­­ly-typ­i­­cal)
Hard­ness>=2H (fam­i­­ly-typ­i­­cal)
Cure Con­di­tionsN/A
Print­ing / Process Para­me­tersN/A
Reli­a­bil­i­ty & Aging Test Results30% elon­ga­tion endurance over 2,000+ cycles (fam­i­­ly-typ­i­­cal)
Stor­age Con­di­tions & Shelf LifeStan­dard series guid­ance : vac­u­um-packed, store 0-10C dark ; ~6-month shelf life ; warm to room temp before use
Dilu­tion Ratio & Vis­cos­i­ty DropN/A
Touch Sen­sor PasteWI-TL20E3 / WI-TL20EA / WI-TL30A / WI-ST70A

A fam­i­ly of RoHS-com­­pli­ant ultra-fine-line, laser-etch­ing-com­­pat­i­ble con­duc­tive sil­ver pastes (and a ded­i­cat­ed resis­­tive-touch-screen screen-print­­ing paste, WI-ST70A) devel­oped for touch-pan­el elec­trode print­ing in lap­tops, tablets, and smart­phones, includ­ing a low-tem­per­a­­ture-cur­ing for­mu­la­tion specif­i­cal­ly devel­oped for smart­phone touchscreens.

  • Good print adapt­abil­i­ty and laser-etch­ing per­for­mance for ultra-fine lines
  • dense, uni­form, well-defined line edges
  • sta­ble con­duc­tiv­i­ty, hard­ness, and adhe­sion after curing
  • good fold resis­tance for touch-pan­el bend­ing requirements.
Appear­ance / Col­orN/A
Vis­cos­i­tyN/A
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­tyCon­sis­tent with WI-TL20/TL30 fam­i­ly (spe­cif­ic val­ue not cap­tured for this code)
Adhe­sion>=4B (fam­i­­ly-typ­i­­cal)
Hard­nessN/A
Cure Con­di­tionsN/A
Print­ing / Process Para­me­tersScreen print­ing down to approx. 60um line width/​spacing ; laser etch­ing achieves sub-30um fine lines ; print speed approx. 100-200m­m/s (WI-TL30E); squeegee trav­el approx. 0.5-2mm (WI-TL30AC/TL20C)
Reli­a­bil­i­ty & Aging Test ResultsN/A
Stor­age Con­di­tions & Shelf LifeStan­dard series guid­ance : vac­u­um-packed, store 0-10C dark ; ~6-month shelf life ; warm to room temp before use
Dilu­tion Ratio & Vis­cos­i­ty DropN/A
Heat­ing Cir­cuit PasteWI-ST80C2

A RoHS-com­­pli­ant flex­i­ble-cir­cuit-print­­ing con­duc­tive sil­ver paste specif­i­cal­ly suit­ed to print­ing con­duc­tive heat­ing cir­cuits for under­floor heat­ing films, shar­ing the WI-ST80 platform's flex­i­bil­i­ty and durability.

  • Good flex­i­bil­i­ty and fold resistance
  • sta­ble resis­tance under repeat­ed ther­mal cycling typ­i­cal of heat­ing-film applications
  • good con­duc­tiv­i­ty and adhe­sion after curing.
Appear­ance / Col­orN/A
Vis­cos­i­tyN/A
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­tyCon­sis­tent with WI-ST80 fam­i­ly (approx. high-teens mOhm/​sq/​mil)
Adhe­sion>=4B (fam­i­­ly-typ­i­­cal)
Hard­ness>=2H (fam­i­­ly-typ­i­­cal)
Cure Con­di­tionsN/A
Print­ing / Process Para­me­tersN/A
Reli­a­bil­i­ty & Aging Test ResultsVal­i­dat­ed under +80C/​500h and -40C/500-1,200h tem­per­a­ture cycling (fam­i­­ly-typ­i­­cal)
Stor­age Con­di­tions & Shelf LifeStan­dard series guid­ance : vac­u­um-packed, store 0-10C dark ; ~6-month shelf life ; warm to room temp before use
Dilu­tion Ratio & Vis­cos­i­ty DropN/A
Sol­der­able Low-Tem­per­a­­ture PasteWI-TL60S2

A RoHS-com­­pli­ant gen­er­al-pur­­pose con­duc­tive sil­ver paste offer­ing both good fine-line print­abil­i­ty and sol­der­abil­i­ty, enabling com­pat­i­bil­i­ty with con­ven­tion­al sol­der­ing process­es in hybrid assem­bly workflows.

  • Good fine-line print adaptability
  • sol­der­able, bridg­ing print­ed con­duc­tive cir­cuits with tra­di­tion­al sol­der­ing steps
  • sta­ble con­duc­tiv­i­ty and adhe­sion after low-tem­per­a­­ture cure.
Appear­ance / Col­orN/A
Vis­cos­i­tyN/A
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­tyCon­sis­tent with WI-TL60 fam­i­ly (spe­cif­ic val­ue not cap­tured for this code)
Adhe­sion>=4B (fam­i­­ly-typ­i­­cal)
Hard­ness>=2H (fam­i­­ly-typ­i­­cal)
Cure Con­di­tionsLow-tem­per­a­­ture cure (fam­i­­ly-typ­i­­cal)
Print­ing / Process Para­me­tersGood fine-line and sol­der­able-pad printability
Reli­a­bil­i­ty & Aging Test ResultsN/A
Stor­age Con­di­tions & Shelf LifeStan­dard series guid­ance : vac­u­um-packed, store 0-10C dark ; ~6-month shelf life ; warm to room temp before use
Dilu­tion Ratio & Vis­cos­i­ty DropN/A
Sin­tered Anten­na PasteWI-INK135S2 / WI-INK135S29C / WI-INK135S29D / WI-INK135S­G9

A RoHS-com­­pli­ant low-tem­per­a­­ture sin­tered anten­na sil­ver paste series suit­ed to a vari­ety of com­mu­ni­ca­tion devices and mobile ter­mi­nal prod­ucts, designed to form a dense, low-resis­­tance con­duc­tive lay­er at reduced sin­ter­ing tem­per­a­tures for tight resis­tance consistency.

  • Sin­­gle-com­po­­nent system
  • fast cure
  • excel­lent toughness
  • good adhe­sion
  • low imped­ance
  • good fill­ing capa­bil­i­ty, thixotropy, con­duc­tiv­i­ty, and sol­vent resistance.
Appear­ance / Col­orSil­ver-gray paste (visu­al inspection)
Vis­cos­i­ty750+/-150 cP (Brook­field CP-51, 100rpm, 2min)
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­ty<10 mOhm/​sq/​mil (mul­ti­me­ter)
Adhe­sion5B (crosscut/​3M610 tape)
Hard­ness>=2H (pen­cil hardness)
Cure Con­di­tions30min @ 130C on PET
Print­ing / Process Para­me­tersN/A
Reli­a­bil­i­ty & Aging Test ResultsN/A
Stor­age Con­di­tions & Shelf LifeVac­u­um-packed ; store 0-10C dark ; shelf life 6 months from pro­duc­tion ; warm to room temp (23+/-2C) 4h before use ; stir 5-10min at 30-50rpm
Dilu­tion Ratio & Vis­cos­i­ty DropDilu­ent ZK-INK135S2/-series, max 2% of total mass. Vis­cos­i­ty drop : 0.5% -> 50-100cP ; 1.0% -> 100-200 ; 1.5% -> 150-250 ; 2.0% -> 200-350
Nanoim­print Sil­ver PasteWI-INK135S29D

A nano con­duc­tive sil­ver paste pur­­pose-built for met­al-mesh tech­nol­o­gy appli­ca­tions, offer­ing excel­lent fill­ing capa­bil­i­ty, thixotropy, con­duc­tiv­i­ty, and sol­vent resis­tance for fine-mesh tran­s­­par­ent-elec­trode structures.

  • Sin­­gle-com­po­­nent system
  • fast cure
  • excel­lent toughness
  • good adhe­sion
  • low imped­ance.
Appear­ance / Col­orSil­ver-gray paste (visu­al inspection)
Vis­cos­i­ty750+/-150 cP (Brook­field CP-51, 100rpm, 2min)
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­ty<10 mOhm/​sq/​mil (mul­ti­me­ter)
Adhe­sion5B (crosscut/​3M610 tape)
Hard­ness>=2H (pen­cil hardness)
Cure Con­di­tions30min @ 130C on PET
Print­ing / Process Para­me­tersN/A
Reli­a­bil­i­ty & Aging Test ResultsN/A
Stor­age Con­di­tions & Shelf LifeVac­u­um-packed ; store 0-10C dark ; shelf life 6 months ; warm to room temp (23+/-2C) 4h before use ; stir 5-10min at 30-50rpm
Dilu­tion Ratio & Vis­cos­i­ty DropDilu­ent ZK-INK135S29D, max 2% of total mass. Vis­cos­i­ty drop : 0.5% -> 50-100cP ; 1.0% -> 100-200 ; 1.5% -> 150-250 ; 2.0% -> 200-350
PEDOT Trans­par­ent Con­duc­tive InkPD-101

A screen-print­­able trans­par­ent con­duc­tive ink based on the con­duc­tive poly­mer PEDOT :PSS, for­mu­lat­ed with a suit­able thick­en­er to raise the vis­cos­i­ty of the aque­ous PEDOT :PSS dis­per­sion to meet screen-print­­ing require­ments, impart­ing con­duc­tiv­i­ty to PET sub­strates while pre­serv­ing opti­cal transparency.

  • Screen-print­­able aque­ous formulation
  • pro­vides a con­duc­tive path on trans­par­ent film sub­strates with­out sig­nif­i­cant­ly reduc­ing opti­cal transparency
  • suit­ed to trans­par­ent anten­na and touch-elec­trode structures.
Appear­ance / Col­orN/A
Vis­cos­i­tyN/A
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­tyN/A
Adhe­sionN/A
Hard­nessN/A
Cure Con­di­tionsN/A
Print­ing / Process Para­me­tersScreen print­ing : squeegee angle 60-80deg (process-para­me­ter guid­ance in the tech­ni­cal data sheet)
Reli­a­bil­i­ty & Aging Test ResultsN/A
Stor­age Con­di­tions & Shelf LifeN/A
Dilu­tion Ratio & Vis­cos­i­ty DropN/A
Trans­par­ent Anten­na PasteWI-INK135S29C

A nano con­duc­tive sil­ver paste pur­­pose-built for met­al-mesh tech­nol­o­gy appli­ca­tions used in trans­par­ent anten­na struc­tures, offer­ing excel­lent fill­ing capa­bil­i­ty, thixotropy, con­duc­tiv­i­ty, and sol­vent resistance.

  • Sin­­gle-com­po­­nent system
  • fast cure
  • excel­lent toughness
  • good adhe­sion
  • low imped­ance.
Appear­ance / Col­orSil­ver-gray paste (visu­al inspection)
Vis­cos­i­ty750+/-150 cP (Brook­field CP-51, 100rpm, 2min)
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­ty<10 mOhm/​sq/​mil (mul­ti­me­ter)
Adhe­sion5B (crosscut/​3M610 tape)
Hard­ness>=2H (pen­cil hardness)
Cure Con­di­tions30min @ 130C on PET
Print­ing / Process Para­me­tersN/A
Reli­a­bil­i­ty & Aging Test ResultsN/A
Stor­age Con­di­tions & Shelf LifeVac­u­um-packed ; store 0-10C dark ; shelf life 6 months ; warm to room temp (23+/-2C) 4h before use ; stir 5-10min at 30-50rpm
Dilu­tion Ratio & Vis­cos­i­ty DropDilu­ent ZK-INK135S29C, max 2% of total mass. Vis­cos­i­ty drop : 0.5% -> 50-100cP ; 1.0% -> 100-200 ; 1.5% -> 150-250 ; 2.0% -> 200-350
Capacitor/​Resistor Ter­mi­na­tion PasteWI-ST60S1 / WI-ST60S11EF

A fam­i­ly of RoHS- and REACH-com­­pli­ant con­duc­tive sil­ver pastes for capac­i­tor and resis­tor com­po­nent end-ter­mi­­na­­tion pro­tec­tion, using a high­ly cross-linked resin sys­tem to deliv­er excel­lent adhe­sion, hard­ness, and fold resis­tance after cure at the com­po­nent elec­trode ends.

  • Excel­lent adhe­sion, hard­ness, and fold resis­tance after cure
  • suit­ed to pro­tect­ing and elec­tri­cal­ly ter­mi­nat­ing pas­­sive-com­po­­nent elec­trode ends
  • sta­ble per­for­mance across pro­duc­tion batches.
Appear­ance / Col­orN/A
Vis­cos­i­tyN/A
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­tyCon­sis­tent with WI-ST60 fam­i­ly (<=20 mOhm/​sq/​mil)
Adhe­sion4B-5B (fam­i­­ly-typ­i­­cal)
Hard­nessN/A
Cure Con­di­tionsN/A
Print­ing / Process Para­me­tersN/A
Reli­a­bil­i­ty & Aging Test ResultsN/A
Stor­age Con­di­tions & Shelf LifeStan­dard series guid­ance : vac­u­um-packed, store 0-10C dark ; shelf life 6 months ; warm to room temp (23+/-2C) 2h before use ; stir 5-10min at 30-50rpm
Dilu­tion Ratio & Vis­cos­i­ty DropProd­uct-spe­­cif­ic dilu­ent (ZK-series), typ­i­cal­ly max 2% of total mass
Induc­tor PasteWI-ST60S

A RoHS-com­­pli­ant fine-line screen-print­­ing con­duc­tive sil­ver paste on the WI-ST60 plat­form, capa­ble of print­ing line width/​spacing down to 80um/​80um, with excel­lent adhe­sion, hard­ness, and fold resis­tance after cure ; com­pat­i­ble with a wide range of domes­tic and inter­na­tion­al ITO sub­strate brands, and used for induc­tor and capac­i­­tive-touch-pan­el elec­trode printing.

  • High thixotropy for good print adapt­abil­i­ty with uni­form, well-defined lines
  • sta­ble print per­for­mance achiev­ing 80um/​80um line width/​spacing
  • dense cured film with strong adhe­sion, high hard­ness, and good conductivity
  • good abra­sion, chem­i­cal, and weath­er­ing resistance.
Appear­ance / Col­orSil­ver-gray paste (visu­al inspection)
Vis­cos­i­ty1,100+/-200 dPa.s (VT-06 Type #2, 25C)
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­ty<=20 mOhm/​sq/​mil (four-point probe/​multimeter)
Adhe­sion4B-5B (crosscut/​3M610 tape)
Hard­ness>=3H (pen­cil hardness)
Cure Con­di­tions30min @ 130C on PET/​ceramic
Print­ing / Process Para­me­tersScreen print­ing : squeegee angle 80deg, depth 0.5-2mm ; print speed 30-150m­m/s ; print thick­ness 8-10um ; screen >=400 mesh polyester/​stainless steel ; pho­­to-emul­­sion thick­ness 8-12um ; mesh ten­sion angle 22.5deg
Reli­a­bil­i­ty & Aging Test ResultsResis­tance change rate <3%; adhe­sion >=4B-5B after 85C/85%RH/1,200h, +80C/​500h & -40C/1,200h cycling, and 5% NaCl/​35C/​72h salt spray
Stor­age Con­di­tions & Shelf LifeVac­u­um-packed ; store 0-10C dark ; shelf life 6 months ; warm to room temp (23+/-2C) 2h before use ; stir 5-10min at 30-50rpm
Dilu­tion Ratio & Vis­cos­i­ty DropDilu­ent ZK-60S, max 2% of total mass. Vis­cos­i­ty vs. dilu­tion : 0.5% -> 50-100 dPa.s ; 1.0% -> 100-200 ; 1.2% -> 560-600 ; 1.5% -> 610-700 ; 1.8% -> 710-750 (note : source table also lists asso­ci­at­ed resis­­tance-change fig­ures of 8/12/15/18 g/​Kg along­side these dilu­tion steps, appar­ent­ly from an adjoin­ing salt-spray weight-loss table — attri­bu­tion between the two tables is not ful­ly unam­bigu­ous in the source PDF layout)
Smart Sens­ing Paste (Smart Wear­able Paste)WI-ST80R1

A RoHS-com­­pli­ant con­duc­tive sil­ver paste devel­oped for elec­tro­­mag­net­ic-shield­­ing seal­ing equip­ment and smart wearable/​sensing appli­ca­tions, dis­tin­guished by unique stretch­a­bil­i­ty (up to 200% elon­ga­tion) while main­tain­ing resis­tance and adhe­sion, applic­a­ble via co-extru­­sion spray­ing and oth­er pro­cess­ing meth­ods ; uses a stretch­able resin as the binder phase and spher­i­cal sil­ver pow­der as the con­duc­tive phase.

  • Excel­lent fold resis­tance and unique stretchability
  • excel­lent adhe­sion to sil­i­cone and sim­i­lar substrates
  • dense cured film with good sur­face con­duc­tiv­i­ty, abra­sion resis­tance, and weatherability.
Appear­ance / Col­orN/A
Vis­cos­i­tyN/A
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­tyN/A
Adhe­sionN/A
Hard­nessN/A
Cure Con­di­tionsN/A
Print­ing / Process Para­me­tersN/A
Reli­a­bil­i­ty & Aging Test ResultsWith­stands up to 200% elon­ga­tion while main­tain­ing sta­ble resis­tance and adhesion
Stor­age Con­di­tions & Shelf LifeVac­u­um-packed ; store 0-10C dark ; use with­in 1 week of open­ing ; shelf life 6 months from pro­duc­tion ; warm to room temp (23+/-2C) 2h before use ; stir 5-10min at 30-50rpm (mechan­i­cal mixer)
Dilu­tion Ratio & Vis­cos­i­ty DropDilu­ent ZK-80R1, max 3% of total mass
Con­duc­tive Shield­ing Paste (Ag / Ag-Al / Ag-Cu / Ni-C)WI-ST219S / WI-ST201S / WI-ST201SP / WI-ST203 / WI-ST201A / WI-YL18 / WI-ST201AL

A fam­i­ly of RoHS-com­­pli­ant EMI shield­ing pastes (sil­ver, sil­ver-alu­minum, and nick­­el-car­bon chemistries) applied via screen print­ing, trans­fer print­ing, or spray­ing to form internal/​external EMI shield­ing coat­ings on a wide range of elec­tron­ic device enclo­sures ; sev­er­al grades are pur­­pose-built for shielding/​sealing equipment.

  • Good con­duc­tiv­i­ty and EMI shield­ing performance
  • strong com­pat­i­bil­i­ty with PET, PC, alloy, and oth­er substrates
  • good abra­sion resis­tance and weatherability
  • con­sis­tent con­tact resis­tance against mul­ti­ple met­al surfaces.
Appear­ance / Col­orSil­ver-gray paste (visu­al inspec­tion) — WI-ST219S rep­re­sen­ta­tive data
Vis­cos­i­ty700+/-150 cP (Brook­field CP-51, 50rpm) — WI-ST219S rep­re­sen­ta­tive data
Sol­id Con­tent72+/-3% (60min@150C oven) — WI-ST219S rep­re­sen­ta­tive data
Sheet Resis­tance / Vol­ume Resis­tiv­i­ty<=14 mOhm/​sq/​mil (four-point probe) — WI-ST219S rep­re­sen­ta­tive data
Adhe­sion>=4B (crosscut/​3M600 tape) — WI-ST219S rep­re­sen­ta­tive data
Hard­ness>=2H (pen­cil hard­ness) — WI-ST219S rep­re­sen­ta­tive data
Cure Con­di­tions90min @ 80C on PET/PC or alu­minum alloy — WI-ST219S rep­re­sen­ta­tive data
Print­ing / Process Para­me­tersScreen print­ing, trans­fer print­ing, or spray­ing (process selec­table by application)
Reli­a­bil­i­ty & Aging Test ResultsN/A
Stor­age Con­di­tions & Shelf LifeVac­u­um-packed ; rec­om­mend­ed stor­age 0-10C dark, room tem­per­a­ture (below 25C); use with­in 1 month, with­in 1 week of open­ing ; shelf life 6 months from pro­duc­tion ; warm to room temp (23+/-2C) 2h before use ; stir 5-10min at 30-50rpm
Dilu­tion Ratio & Vis­cos­i­ty DropDilu­ent ZK-219S, max 10% of total mass (WI-ST219S); com­pa­ra­ble ZK-series dilu­ents used for oth­er grades in the family
Con­duc­tive Shield­ing Gas­ket & Elas­tomer­ic Con­duc­tive Con­nec­torWI-SL2012 / WI-SL2022 / WI-SL2031 / Elas­tomer­ic Con­duc­tive Connector

A sil­i­­cone-core, sil­ver- or nick­­el-car­bon-coat­ed elas­tomer prod­uct line (dual-col­or com­pos­ite shield­ing gas­kets and hol­low-cylin­der elas­tomer­ic con­nec­tors) com­bin­ing seal­ing and EMI shield­ing in a sin­gle com­po­nent, tar­get­ed at com­mu­ni­ca­tions equip­ment, aero­space, med­ical, elec­tron­ics, machin­ery, rail tran­sit, and new-ener­­gy applications.

  • Sta­ble con­duc­tive resis­tance before/​after aging (100C/​168h)
  • oper­ates across -55C to 160C
  • low com­pres­sion set with excel­lent resilience (>92% rebound after aging/​compression test)
  • excel­lent salt-spray and seal­ing performance
  • con­sis­tent shield­ing effec­tive­ness over the product's ser­vice life.
Appear­ance / Col­orSil­ver-yel­low (elas­tomer­ic con­nec­tor : sil­i­cone rub­ber core with sil­ver-paste con­duc­tive coat­ing, hol­low-cylin­der design ; out­er lay­er 40-80um, inner lay­er 20-80um, end-face coat­ing 25-65um)
Vis­cos­i­tyN/A
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­tySur­face resis­tance <=2 Ohm ; vol­ume resis­tiv­i­ty <=0.004 Ohm​.cm (MIL-DTL-83528C); elas­tomer­ic con­nec­tor : resis­tance <=0.05 Ohm (mil­liohm-meter, end-to-end)
Adhe­sion5B (ISO 2409) — elas­tomer­ic connector
Hard­ness60+/-5 Shore A (GB/T 531.1-2008) — elas­tomer­ic connector
Cure Con­di­tionsN/A
Print­ing / Process Para­me­tersN/A
Reli­a­bil­i­ty & Aging Test ResultsShield­ing effec­tive­ness 110dB across 0.3-20GHz (MIL-STD-285); surface/​volume resis­tiv­i­ty sta­ble after -40C/​48h low-temp and 100C/​168h high-temp expo­sure ; sta­ble after 85C/85%RH/1,000h and 100C/1,000h dry-heat aging ; sur­vives 25,000 com­pres­sion cycles at 30% deflec­tion with no cracking/​delamination ; com­pres­sion set <10% after 1,000h at 100C dry heat and <10% after 1,000h at 85C/85%RH ; elas­tomer­ic con­nec­tor com­pres­sion set <=22% after 1,000h at 125C ; ten­sile strength 3.0+/-0.5MPa (ASTM D412) at RT/-40C(48h)/100C(168h)/thermal-cycled ; adhe­sive back­ing : RT peel >=25N/​mm, 100C/​168h peel >=40N/​mm, -40C/​48h peel >=25N/​mm (GB/T 2792); base rub­ber tear strength 40+/-5N/mm, ten­sile strength 9.0+/-0.5MPa, elon­ga­tion at break 750+/-100% (ASTM D412/GB/T 529-2008); aged ten­sile-strength reten­tion >=90%, aged elon­ga­tion reten­tion >=90%, aged com­pres­sion set <=0.5% (UL 60950-22:2017); flame rat­ing UL 94 HB ; mold resis­tance Grade 0 (GB/T 2423.16); ozone resis­tance : no crack­ing (GB/T 7762-2014); halo­­gen-free (BS EN14582); RoHS-con­­for­­mant (IEC 62321); no oil bleed after 100C/​48h
Stor­age Con­di­tions & Shelf LifeShelf life 12 months ; store in a dark envi­ron­ment ; after open­ing, reseal in a self-seal­ing bag for extend­ed storage
Dilu­tion Ratio & Vis­cos­i­ty DropN/A
FIP (Form-in-Place) Nick­­el-Car­bon Gas­ket Adhe­siveWI-NP05 / WI-NP06

A two-com­po­­nent, low-tem­per­a­­ture-cur­ing con­duc­tive adhe­sive com­posed pri­mar­i­ly of sil­i­cone rub­ber and nick­­el-coat­ed graphite pow­der, suit­ed to form-in-place (FIP) dis­pens­ing process­es for EMI shield­ing in com­plex or intri­cate­ly shaped spaces ; wide­ly used in com­mu­ni­ca­tions equip­ment, elec­tron­ics prod­ucts, and inverters.

  • Sta­ble elec­tri­cal per­for­mance before and after aging
  • high bond strength to met­al surfaces
  • high resilience for good seal­ing performance
  • enables small-space, fast dis­pens­ing pro­cess­ing and can be cus­tomized to spe­cif­ic cus­tomer requirements.
Appear­ance / Col­orGray-black paste (visu­al inspection)
Vis­cos­i­tyCom­po­nent A approx. 55,000+/-5,000 cP ; Com­po­nent B approx. 55,000+/-5,000 cP ; mixed (1:1) approx. 55,000+/-5,000 cP (Brook­field CP-51, 5rpm, 25C); thixotrop­ic index >=3.5 (CP-51, 0.5/5rpm)
Sol­id Con­tentN/A
Sheet Resis­tance / Vol­ume Resis­tiv­i­tyVol­ume resis­tiv­i­ty <=0.03 Ohm​.cm (MIL-DTL-83528C)
Adhe­sionN/A
Hard­ness50+/-5 Shore A (Shore durometer)
Cure Con­di­tions30min @ 150C on alu­minum substrate
Print­ing / Process Para­me­tersTwo-com­po­­nent, 1:1 weight-ratio mix­ing ; suit­ed to form-in-place (FIP) dis­pens­ing equipment
Reli­a­bil­i­ty & Aging Test ResultsVol­ume resis­tiv­i­ty sta­ble at <=0.03 Ohm​.cm after 150C/​48h and 85C/85%RH/1,000h aging ; shield­ing effec­tive­ness >90dB across 0.3-9GHz (MIL-STD-285); oper­at­ing tem­per­a­ture range -55C to 160C (ASTM D1329); den­si­ty 1.6+/-0.2 g/​cm3 (ASTM D792)
Stor­age Con­di­tions & Shelf LifeStore 0-10C dark ; shelf life 6 months from pro­duc­tion ; warm to room temp (23+/-2C) 1h before use ; mix A:B at 1:1 by weight, stir 30-60min, vac­u­um-defoam if bub­bles are introduced
Dilu­tion Ratio & Vis­cos­i­ty DropIf dilu­ent is required, use no more than 3% of total mass (sin­gle addition)