Structure of Stannous sulfate CAS 7488-55-3

Iden­ti­fi­ca­tion

CAS Number

7488-55-3

Name

Stan­nous sulfate

Syn­onyms

$l^{2}-stannane disul­fate
19307-28-9
[RN]
231-302-2
[EINECS]
242-952-1
[EINECS]
7488-55-3
[RN]
tin bis(sulphate)tin sulphate

SMILES

O=S(=O)([O-])[O-].O=S(=O)([O-])[O-].[SnH2]

Std­InChI

InChI=1S/2H2O4S.Sn.2H/​c21-5(2,3)4;;;/h2(H2,1,2,3,4);;;/p-4

Std­InChIKey

IOPRYLM­B­V­­SO­­JAT-UHF­F­­FAOYSA-J

Mol­e­c­u­lar Formula

SnSO4

Mol­e­c­u­lar Weight

214.77

EINECS

231-302-2

MDL number

MFCD00011246

Prop­er­ties

Appear­ance

White pow­der

Safe­ty Data

Sym­bol

exclamation-mark-jpgexclamation-mark-jpgexclamation-mark-jpgexclamation-mark-jpgGHS05, GHS07, GHS08, GHS09

Sig­nal Word

Warn­ing

Haz­ard statements

H290,H315,H317,H319,H332,H335,H341,H373,H410

Pre­cau­tion­ary Statements

P273 – P280 – P302 + P352 – P304 + P340 + P312 – P305 + P351 + P338 – P308 + P313

Spec­i­fi­ca­tions and Oth­er Infor­ma­tion of Our Stan­nous sul­fate CAS 7488-55-3

Intro­duc­tion

Refined and crys­tal­lized from high-puri­­ty tin, this prod­uct fea­tures sta­ble tin con­tent and extreme­ly low impu­ri­ty lev­els. It dis­solves rapid­ly with­out leav­ing residue and sim­pli­fies plat­ing bath main­te­nance, yield­ing tin deposits with fine grain struc­tures and high bright­ness ; it also serves as a sta­ble tin source for elec­tron­ic-grade applications.

Key Fea­tures

1. High puri­ty 2. Rapid dis­so­lu­tion with no residue 3. Fine-grained, bright plat­ing deposits

Puri­ty

99.9%~99.99%

Shelf Life

2 years

Stor­age

Under room tem­per­a­ture away from light

Known Appli­ca­tion

1. Elec­tro­plat­ing for advanced semi­con­duc­tor pack­ag­ing 2. Elec­tro­plat­ing for high-end PCBs and 5G high-fre­quen­­cy con­nec­tors 3. Pho­to­volta­ic sec­tor (TOP­Con rib­bon, CZTS thin-film solar cells) 4. Pre­cur­sors for new ener­gy lithi­um-ion bat­tery and super­ca­pac­i­tor materials

This prod­uct is devel­oped by our R&D com­pa­ny Wat­sonChem Advanced Chem­i­cal Mate­ri­als (https://​www​.wat​sonchem​.com/).

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