Phenyl ester epoxy curative hybrid of diallyl bisphenol A
Specifications and Other Information of Our Phenyl ester epoxy curative hybrid of diallyl bisphenol A CAS 107466-61-9
Dual cure mechanism; High cross-link density;Multifunctional;Thermal stability
According to customer requirements to packaging
Under the room temperature and away from light
Used as the B-stageable adhesives; Epoxy and BMI co-curative
This product is developed by our R&D company Warshel Chemical Ltd(http://www.warshel.com/), and here is the corresponding link:
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